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Capabilities
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Single Layer to Multilayer
Scoring
Edge Milling
3 mil lines and 3 mil air gaps
Differential & Controlled impedance
Half moon & Edge plating
FR4
Flex/ Rigid Flex
Burn-in
Hybrid (Mixed dielectric for PCB)
Hi temp
Blind & Buried vias
Buried Register (402)
Thin core
8 mil vias & 4 mil with laser drill
Laser routing
Lead free Laminates
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Design Quote Requirements |
Design |
Materials
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