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Design & Layout Capabilities

DC to 1Ghz
Differential & Controlled Impedance
Micro-BGA & BGA Technology
Bill of Materials
NC drill & GBR data.
Mechanical layout
Signal Integrity
High Density Placement
Artwork and layout verification
High/ Low speed Analog, Digital, RF

Single layer to multilayer design
Netlist translation
Design for Test
Differential pairs, matched length traces
Thru-hole to SMT or BGA conversion
Reverse Engineering
IPCD-275, Mil-Std, IPC-2221, IPC-D325, ANSI, IEEE, and Customer
Layer counts reduction
Crosstalk analysis
Blind/ vias
Surface mount design of Burn-in boards

Design Quote Requirements   |   Capabilities   |   Materials