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Design & Layout Capabilities
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DC to 1Ghz Differential & Controlled Impedance Micro-BGA & BGA Technology Bill of Materials NC drill & GBR data. Mechanical layout Signal Integrity High Density Placement Artwork and layout verification High/ Low speed Analog, Digital, RF
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| Single layer to multilayer design Netlist translation Design for Test Differential pairs, matched length traces Thru-hole to SMT or BGA conversion Reverse Engineering IPCD-275, Mil-Std, IPC-2221, IPC-D325, ANSI, IEEE, and Customer specification Layer counts reduction Crosstalk analysis Blind/ vias Surface mount design of Burn-in boards
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Design Quote Requirements | Capabilities | Materials
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